Thermal Gap Fillers
Gap pads or fillers provide an effective thermal interface between heat sinks and electronic devices where uneven surface topography , air gaps and rough surface textures are present. These filled silicone polymer sheets are used to provide thermal solutions when interface gaps are greater than 0.5mm. They are easy-to handle, re-workable and excellent for complicated die cut shapes. They offer good compression for stress relief and shock dampening.
Pronat offers a full range of thermally conductive materials as shown below. These materials have been selected for their excellent conductivity rating ( W/m-K) for each thickness sector, soft/hard parameters and consistent durability under stress.
Availability: Cut sheets and die-cut parts
Recommended Gap fillers available from stock in various thicknesses:
| Thickness | Hardness | Dielectric Strength | Thermal Conductivity | Material | |
| mm | Shore A | Kv/mm | W/m-K | ||
| GF-868G | 0.5 – 15 | 15 | 2 | 5.00 | silicone rubber |
| GF-866G | 0.8- 6.0 | 5±3 | 8 | 3.15 | silicone rubber |
| GF-866ER | 0.5-6.0 | 5±3 | 6 | 2.00 | silicone rubber fiber glass reinforced |
| GF-868B | 0.3- 6.0 | 15±3 | ˃5 | 3.00 | silicone rubber |
| GF-8620AR | 0.5-5.0 | 10±3 | 6 | 7.00 | silicone rubber |
Pronat stocks and converts gap fillers from world leading manufacturers for a wide range of electronic applications.
Some of our supply partners of thermal gap fillers include:
- Grow Rich
- Saint Gobain – ThermalCool grades
- Fujipoly – Sarcon grades
- Chomerics
- Bergquist
