Form-in-Place
EMI Form-in-Place. An EMI paste can be dispensed onto conductive surfaces, such as an enclosure to form an EMI gasket. The surface of the electronic enclosure can be painted, plated, or metal. This dispensing process, utilizing a 3 axis robot, is ideal where the enclosure has narrow, complex or rounded surfaces, or contains miniature devices requiring a precision gasket. The solution protects the enclosure against internal and external radiated interference. Form-in-Place is an ideal solution where the usual O-ring placement in a groove cannot be satisfactorily achieved.
