3M™ Scotch-Weld™ Structural Adhesive Films
3M™ Scotch-Weld™ Structural Adhesive Film AF 163-2 is a thermally expanding films for gap filling. It provides excellent performance with easy-to-use shop handling properties. These adhesive films are available in a variety of weights and carriers to meet a range of needs without imposing excess material costs.
With high fracture toughness and peel strength, AF 163-2 provides a reliable, long-term bond suitable for composites, metals in solid panel and honeycomb sandwich fabrication. We also offer an unsupported version, which can be used for reticulation. It is also compatible with multiple substrates and primers. In addition, AF 163-2 exhibits excellent pre-bond humidity performance on composite substrates.
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These thermally expanding films for gap filling, have a high performance over a broad range of temperature.
- Excellent shear strength even at elevated temperatures.
- Adhesive can be cured from 80°C up to 150°C
- Excellent pre-bond humidity performance on composite substrates.