PRONAT Electronics
- Thermal Conductivity
Thermal Gap Fillers
Gap pads or fillers provide an effective thermal interface between heat sinks and electronic devices where uneven surface topography , air gaps and rough surface textures are present. These filled silicone polymer sheets are used to provide thermal solutions when interface gaps are greater than 0.5mm. They are easy-to handle, re-workable and excellent for complicated die cut shapes. They offer good compression for stress relief and shock dampening.
Thin Thermal Conductive Pads
These standard or fabric reinforced silicone polymer sheets are used to provide thermal management solutions where interface gaps are less than 0.50mm. These materials can be used for low cost thermal transfer requiring minimal thickness, high physical and mechanical characteristics. The fiberglass/silicone compound construction provides excellent cut through resistance, good thermal conductivity and excellent electrical insulation.
Thermal Phase Change
Thermal phase change materials are solid pads at room temperature that melt at preset operating temperatures above 50°C and provide complete wet-out of the interface, thereby eliminating any air gaps.
Keratherm® Ceramic tape
KERATHERM® are highly flexible products made of thermally conductive and electrically insulating single or multi-component polymers, which are filled with ceramic or thermally conductive materials.
Keratherm® thermal interface materials ensures efficient cooling of the electronic components by connecting the heat source to the heat sink.
A mechanical reinforcement of Keratherm® by means of integrated glass fiber fabric or other materials offers the user a versatile product. Due to its flexibility and very good physical properties, extensive applications in electronics is possible.
Keratherm® is commonly used in conjunction with power electronics inautomotive applications such as batteries, electric powertrains, LED lighting, on-board chargers, sensors and much more.
Bergquist Super Conductive Pads
Thermal pads having exceptional thermal conductivity.
Typical Applications
Consumer electronics – Power supplies – Automotive electronics – LED, LCD and optical displays
Motor controls – power semiconductors batteries
|
TGP 18000SF |
thermal conductivity |
18 W/m-k |
|
TGP 40000SF |
thermal conductivity |
40 W/m-k |
Thermal Tapes & Adhesives Transfer Tapes
Thermally conductive pressure sensitive adhesive tapes provide solutions for difficult thermal management challenges. These products can be used in place of mechanical fasteners, provide excellent thermal coupling between components and heat sinks and can accommodate materials of different coefficients of thermal expansion with the compliant interface. All of the adhesives are flame retardant and are formulated for high performance adhesion while still being easily re-workable without damage to sensitive components.
Pronat stocks world class thermal management materials
Pronat stocks world class thermal management materials.
Some of our supply partners of thermal gap fillers include:
- Grow Rich
- Saint Gobain – ThermalCool grades
- Fujipoly – Sarcon grades
- Chomerics
- Bergquist
- Kerafol ceramic material
Thermally Conductive Pastes & Gels
These materials are screened, stenciled or dispensed and require virtually no compressive force to conform under typical assembly pressures. Good surface wetting results in low interfacial resistance. Rather messy to apply for low volumes, for large quantities an automatic dispensing system is normally used. Clean removal is difficult.
